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Ultra fine high-purity alumina is a cornerstone material in fields such as electronic information, new energy, high-end manufacturing, and biomedicine. Its application value lies in the precise control of purity, particle size, crystal form, and morphology. Purity determines the upper limit of performance, particle size determines sintering/dispersion/activity, and crystal structure determines functional characteristics. With the development of 5G, solid-state batteries, third-generation semiconductors, and biomedicine, the demand for 6N grade ultra-high purity, monodisperse nanoscale, and spherical alumina will continue to grow. This article discusses the practical applications of ultrafine and high-purity alumina powder.

​Why are d10, d50, and d90 key parameters used to describe the particle size distribution characteristics of particles in slurries (such as silver slurries). Here is a specific explanation:

Silver coated copper technology is a composite metal material technology, and its core product silver coated copper powder is composed of copper in the core and silver shell covering its surface. A typical silver layer thickness is between 50-200 nanometers, with a silver content (mass ratio) of 5% -30%. In this structure, the copper core plays a role in providing low cost and high conductivity, while the silver shell is crucial in ensuring that the particles resist oxidation during processes such as pulping and printing, while forming good ohmic contact with the battery silicon wafer or TCO film. After sintering, the silver shell acts as a conductive medium, ensuring low contact resistance and reliable adhesion of the electrode, while the copper core reduces material costs while endowing the slurry with certain mechanical strength and thermal stability.

Copper is different from metals such as aluminum and nickel in that it is difficult to form a dense and stable intrinsic passivation layer on its surface. Therefore, the exposed copper surface will be continuously oxidized and corroded by oxygen and water vapor in the air. The smaller the particle size and larger the specific surface area of copper powder, the easier it is to rapidly oxidize to produce products such as cuprous oxide (Cu2O) and copper oxide (CuO). This oxide insulation layer significantly reduces the conductivity of copper powder and hinders particle sintering connection, resulting in degradation of the performance of the conductive paste.

Since ancient times, silver has been widely used for wound treatment and water purification due to its natural antibacterial properties. After entering the nano era, silver nano powder (particle size is usually between 1~100 nm) can release higher concentration of active silver ions (Ag+) due to its extremely high specific surface area, showing far more biological activity than macro silver materials. At present, nanosilver has moved from laboratory research to clinical applications, becoming an important supplement to modern anti infective medical systems.

​The role of nano silica powder in cement is mainly reflected in enhancing material properties, improving structural stability, and enhancing durability