Technical articles

SAT NANO regularly shares technical articles on nano powder and micron powder, and answers technical problems encountered by customers in using products. By sharing technical articles, it can help others understand and learn about relevant fields of knowledge, promote knowledge sharing and dissemination, and promote technological progress and innovation.
  • Copper is different from metals such as aluminum and nickel in that it is difficult to form a dense and stable intrinsic passivation layer on its surface. Therefore, the exposed copper surface will be continuously oxidized and corroded by oxygen and water vapor in the air. The smaller the particle size and larger the specific surface area of copper powder, the easier it is to rapidly oxidize to produce products such as cuprous oxide (Cu2O) and copper oxide (CuO). This oxide insulation layer significantly reduces the conductivity of copper powder and hinders particle sintering connection, resulting in degradation of the performance of the conductive paste.

    2025-09-30

  • ​Copper nanoparticles have attracted a lot of interest in recent years due to their interesting properties, low-cost preparation, and many potential applications in catalysis, cooling fluids, or conductive inks. In this study, copper nanoparticles were synthesized by chemical reduction of copper sulfate CuSO4 and sodium borohydride NaBH ₄ in water without inert gas protection.

    2025-09-27

  • ​Graphene coated copper and silver coated copper have essential differences in conductivity, each with its own advantages and disadvantages, and their applicable scenarios are also different.

    2025-09-19

  • How to prepare the ferric oxide powder Fe3O4 nanopowder? Let's briefly introduce the manufacturing process, and you can also follow this method to make it.

    2025-09-17

  • Silver coated copper technology is a composite metal material technology, and its core product silver coated copper powder is composed of copper in the core and silver shell covering its surface. A typical silver layer thickness is between 50-200 nanometers, with a silver content (mass ratio) of 5% -30%. In this structure, the copper core plays a role in providing low cost and high conductivity, while the silver shell is crucial in ensuring that the particles resist oxidation during processes such as pulping and printing, while forming good ohmic contact with the battery silicon wafer or TCO film. After sintering, the silver shell acts as a conductive medium, ensuring low contact resistance and reliable adhesion of the electrode, while the copper core reduces material costs while endowing the slurry with certain mechanical strength and thermal stability.

    2025-09-04

  • When carrying out the airflow crushing process, it is usually encountered that the moisture absorption of the crushed material significantly increases, and it still absorbs water after drying. How to control it.

    2025-08-14

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