Copper oxide nanoparticles (CuO NPs) are tiny particles with extraordinary properties—high surface area, antimicrobial activity, and excellent thermal conductivity. If you're in electronics, healthcare, or energy storage, these nanoparticles might be the game-changer you’ve been overlooking.
Thermal conductive filler is a functional material added to matrix materials such as plastics, rubber, adhesives, etc. to improve their thermal conductivity. They significantly improve the thermal conductivity efficiency of composite materials by forming thermal conduction pathways or networks, and are widely used in electronic device heat dissipation, LED lighting, energy storage, aerospace and other fields.
Compared with traditional manufacturing materials, 3D printing powder has many advantages.
The 14th Shenzhen International Thermally Conductive Materials and Equipment Exhibition, also known as CIME2025, is set to take place on June 4-6, 2025, at the Shenzhen International Convention and Exhibition Center. With an expansive exhibition area of 20,000 square meters, the event is expected to host 500 exhibitors, 30 academic presentations, and attract approximately 30,000 professional visitors. CIME, originating in Shenzhen in 2013, has evolved over the past decade into a prestigious industry event in the field of thermal management and thermally conductive materials, now hosting exhibitions in Shenzhen in June and in Shanghai in December.
Researchers have recently developed a novel light-responsive double network hydrogel based on methyl acrylated peptide nanofibers (PNFMA) with high biocompatibility, excellent biodegradability, and multifunctionality for the modulation of cancer cells in photothermal therapy.
Single layer graphene is known as the "king of materials" due to its unique two-dimensional honeycomb lattice structure and electronic band characteristics, which exhibit excellent performance in conductivity and thermal conductivity. The following is a detailed analysis of its conductivity and thermal conductivity:
